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| IC tray foundation information and China 's prospect |
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| Source£ºBoye International Trade Co., Ltd. Release time£º2017-03-04 |
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IC tray foundation information and China 's prospect
IC Tray is the packaging tray used by the Semiconductor Packaging Co., Ltd. for its chip (IC) packaging test.
Function: anti-static, high temperature.
Package: BGA, QFP, TSOP, PGA, QFN, PLCC package composition
Material: mppo, ppe, psu, mpsu, mppe, pes, pas, pp, enhanced abs, ps and so on
And then the recovery and production of these plastic pallets can maximize the use of the value of materials, but also in response to the Government's proposed circular economy policy is to solve the problem of environmental pollution, the best way. Our policy is through our service,
To maximize the avoidance of plastic pallets and other exiled to Hu Ge public places, through our re-processing was used from scratch or as a renewable material used in other similar goods
China's plastic IC tray recycling is in the high-speed increase period, the plastic tray in the IC tray output value of the share for six consecutive years increased from 8.3% in 2003 rose to 12.74% in 2008 [6]. It is not difficult to foresee, with the IC tray needs continue to increase, environmental maintenance and ISPM 15 restrictions on the impact of the future of the traditional wooden IC tray in some occupations will be gradually replaced by a new type of plastic tray. With the development of the plastics industry, Hu Ge and the company is also facing a green question, the concept of green plastic by many companies bear, renewable plastics and biodegradable / biodegradable plastics will be more widely used. At present, the plastic raw materials to the energy-saving high-tech complex new materials to carry out, stop and cut the use of toxic and harmful materials, the development of excellent use of alternative materials, by Hu Ge and the company's attention, which will be China The construction of the plastic IC tray offers endless driving force. Built-in steel pipe tray large-scale planning production, can be 100% recovery and regeneration of the vibration molding method and gas-assisted injection molding and other new plastic IC tray recycling molding technology to continue to explore, IC tray structure of the continuous improvement of design and RFID radio frequency identification skills Development, but also to the rise of the occupation of our country to bring unlimited vitality and vitality. With the continuous expansion of the opening to the outside world and the widespread impact of low-carbon production, plastic IC tray will be in the future logistics tray occupies a dominant position, the use of China's plastic IC tray will also have a very broad prospects for development.
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